| SPC OverView F3 | ||||
|---|---|---|---|---|
| Alarm rule | Total SPC point | OK point | NG rule 1 point | rule 3,4 point |
| Factory | F3 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Station | SPI | IPQC SMT | IPQC Punching | OQC | |||||||||||
| ControlItem | Solder Volume (%) | Solder Height (µm) | Solder Area (%) | Solder Shift X (µm) | Solder Shift Y (µm) | IPQC Component Peeling Test | IPQC Component Pulling Test | IPQC FAI dimension | OQC ACF Bonding | OQC B2B Pulling test | OQC B2B Shearing test | OQC B2B Peeling Test | OQC Dimension | OQC PSA/TSA peeling force | OQC Liner peeling force |
| SPC OverView F4 | ||||
|---|---|---|---|---|
| Alarm rule | Total SPC point | OK point | NG rule 1 point | rule 3,4 point |
| Factory | F4 | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Station | SPI | IPQC SMT | IPQC Punching | OQC | |||||||||||
| ControlItem | Solder Volume (%) | Solder Height (µm) | Solder Area (%) | Solder Shift X (µm) | Solder Shift Y (µm) | IPQC Component Peeling Test | IPQC Component Pulling Test | IPQC FAI dimension | OQC ACF Bonding | OQC B2B Pulling test | OQC B2B Shearing test | OQC B2B Peeling Test | OQC Dimension | OQC PSA/TSA peeling force | OQC Liner peeling force |