OverView F3 | ||||
---|---|---|---|---|
Alarm rule | Total point | OK point | NG rule 1 point |
Factory | F3 | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Station | Reflow | IPQC SMT | SPA | ICT | Rate | ||||||||||
Control Item | Reflow: Oxygen Concentration | Reflow: Profile Condition (Peak temp) | Reflow: Profile Condition (Preheat 130-200°C (1)) | Reflow: Profile Condition (Preheat 200-217°C (2)) | Reflow: Profile Condition (Reflow Time /217°C) | Reflow: Profile Condition (Slope 1 (30-130°C)) | Reflow: Profile Condition (Slope 2 (240-217°C)) | Reflow: Temperature | IPQC X-section | SPA: Stencil Tension Force | ICT Resistence |
OverView F4 | ||||
---|---|---|---|---|
Alarm rule | Total point | OK point | NG rule 1 point |
Factory | F4 | ||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Station | Reflow | IPQC SMT | SPA | ICT | Rate | ||||||||||
Control Item | Reflow: Oxygen Concentration | Reflow: Profile Condition (Peak temp) | Reflow: Profile Condition (Preheat 130-200°C (1)) | Reflow: Profile Condition (Preheat 200-217°C (2)) | Reflow: Profile Condition (Reflow Time /217°C) | Reflow: Profile Condition (Slope 1 (30-130°C)) | Reflow: Profile Condition (Slope 2 (240-217°C)) | Reflow: Temperature | IPQC X-section | SPA: Stencil Tension Force | ICT Resistence |