SSG-SMART FACTORY SOLUTION - SPC Overview

SPC OverView F3
Alarm rule	Total SPC point	OK point	NG rule 1 point	rule 3,4 point

Factory	F3
Station	SPI					IPQC SMT		IPQC Punching	OQC
ControlItem	Solder Volume (%)	Solder Height (µm)	Solder Area (%)	Solder Shift X (µm)	Solder Shift Y (µm)	IPQC Component Peeling Test	IPQC Component Pulling Test	IPQC FAI dimension	OQC ACF Bonding	OQC B2B Pulling test	OQC B2B Shearing test	OQC B2B Peeling Test	OQC Dimension	OQC PSA/TSA peeling force	OQC Liner peeling force

SPC OverView F4
Alarm rule	Total SPC point	OK point	NG rule 1 point	rule 3,4 point

Factory	F4
Station	SPI					IPQC SMT		IPQC Punching	OQC
ControlItem	Solder Volume (%)	Solder Height (µm)	Solder Area (%)	Solder Shift X (µm)	Solder Shift Y (µm)	IPQC Component Peeling Test	IPQC Component Pulling Test	IPQC FAI dimension	OQC ACF Bonding	OQC B2B Pulling test	OQC B2B Shearing test	OQC B2B Peeling Test	OQC Dimension	OQC PSA/TSA peeling force	OQC Liner peeling force

1. Xbar chart Qty NG

Point	Rule 1	Rule 2	Rule 3	Rule 4	Rule 5	Rule 6	Rule 7	Rule 8

1. R chart Qty NG

Point	Rule 1	Rule 2	Rule 3	Rule 4	Rule 5	Rule 6	Rule 7	Rule 8

1. Check Rule of point

Chart Name	Rule 1	Rule 2	Rule 3	Rule 4	Rule 5	Rule 6	Rule 7	Rule 8

2. Point data

Points			BlockId/PcsId	PadNo		DateTime

3. LinkData

1. Check Rule of point

P Chart	Rule 1	Rule 2	Rule 3	Rule 4	Rule 5	Rule 6	Rule 7	Rule 8

2. Point data

Points	P Value	TotalNG	TotalOK	TotalQuantity	DateTime

ControlItem	FPCClean: PressureValue	FPCClean: SpeedValue	Prebaking	Reflow: Oxygen Concentration	Reflow: Profile Condition (Peak temp)	Reflow: Profile Condition (Preheat 130-200°C (1))	Reflow: Profile Condition (Preheat 200-217°C (2))	Reflow: Profile Condition (Reflow Time /217°C)	Reflow: Profile Condition (Slope 1 (30-130°C))	Reflow: Profile Condition (Slope 2 (240-217°C))	Reflow: Temperature	SPA: Stencil Tension Force	OQC Plasma (ACF & GND)	OQC ACF roughness	OQC ACF Flatness	OQC 2D barcode grade	IQC Solder paste Viscosity	IQC Solder paste Particle Dimension	IQC PSA/Liner Dimension/Thickness	IQC Packing Tray Dimension	IQC Bare FPC WCA (PSA and Soldering Pad area)	IQC Bare FPC Ni/Au thickness	IQC Bare FPC ACF Pad Roughness	IQC B2B Plating thickness	IQC B2B Dimension	IQC B2B Coplanarity	IPQC X-section	IPQC Plasma WCA on GND	IPQC Plasma WCA on ACF

LineID	ItemName	Alarm point