SSG-SMART FACTORY SOLUTION - IPQC Trend OverView

OverView F3
Alarm rule	Total point	OK point	NG point

Factory	F3
Station	Parameter Process	IPQC	OQC	IQC

OverView F4
Alarm rule	Total point	OK point	NG point

Factory	F4
Station	Parameter Process	IPQC	OQC	IQC

1. Xbar chart Qty NG

Point	Rule 1	Rule 2	Rule 3	Rule 4	Rule 5	Rule 6	Rule 7	Rule 8

1. R chart Qty NG

Point	Rule 1	Rule 2	Rule 3	Rule 4	Rule 5	Rule 6	Rule 7	Rule 8

1. Check Rule of point

Chart Name	Rule 1	Rule 2	Rule 3	Rule 4	Rule 5	Rule 6	Rule 7	Rule 8

2. Point data

Points			BlockId/PcsId	PadNo		DateTime

3. LinkData

1. Check Rule of point

P Chart	Rule 1	Rule 2	Rule 3	Rule 4	Rule 5	Rule 6	Rule 7	Rule 8

2. Point data

Points	P Value	TotalNG	TotalOK	TotalQuantity	DateTime

ControlItem	FPCClean: PressureValue	FPCClean: SpeedValue	Prebaking	Reflow: Oxygen Concentration	Reflow: Profile Condition (Peak temp)	Reflow: Profile Condition (Preheat 130-200°C (1))	Reflow: Profile Condition (Preheat 200-217°C (2))	Reflow: Profile Condition (Reflow Time /217°C)	Reflow: Profile Condition (Slope 1 (30-130°C))	Reflow: Profile Condition (Slope 2 (240-217°C))	Reflow: Temperature	SPA: Stencil Tension Force	OQC Plasma (ACF & GND)	OQC ACF roughness	OQC ACF Flatness	OQC 2D barcode grade	IQC Solder paste Viscosity	IQC Solder paste Particle Dimension	IQC PSA/Liner Dimension/Thickness	IQC Packing Tray Dimension	IQC Bare FPC WCA (PSA and Soldering Pad area)	IQC Bare FPC Ni/Au thickness	IQC Bare FPC ACF Pad Roughness	IQC B2B Plating thickness	IQC B2B Dimension	IQC B2B Coplanarity	IPQC X-section	IPQC Plasma WCA on GND	IPQC Plasma WCA on ACF

LineID	ItemName	Alarm point